Provided is a liquid crystalline polyester resin for extrusion molding having a solder heat resistant temperature of 250.degree. C. or more, wherein the ratio ((viscosity 2b)/(viscosity 1b)) of the melt viscosity (viscosity 1b) under a shearing speed of 1000/sec at the flow initiation temperature and the melt viscosity (viscosity 2b) under the same shearing speed at a temperature 20.degree. C. higher than the flow initiation temperature is from 0.10 to 0.70. The extrusion molding material of the above-described liquid crystalline polyester resin has excellent heat resistance, and can provide an extrusion molded article, especially a film having excellent appearance.