A present invention is to provide a thin parts installation structure and their manufacturing method. There is provided a circuit on a wiring substrate, an adhesive is painted to a selected part installation position on the wiring substrate, a conductive adhesive is painted in a position where the terminal area of electronic parts contact the wiring pattern circuits. The electronic part is put in the selected position of wiring the substrate such that the terminals of the electronic parts contact the conductive adhesive prior to curing the adhesives, and followed by both the non-conductive adhesive and conductive adhesive are stiffened.