Invention Grant
- Patent Title: Device and method for fitting individual wires to IDC contacts
- Patent Title (中): 将各线连接到IDC触点的装置和方法
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Application No.: US243830Application Date: 1999-02-01
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Publication No.: US6145192APublication Date: 2000-11-14
- Inventor: Werner Moyaert , Philippe Van Steenkiste
- Applicant: Werner Moyaert , Philippe Van Steenkiste
- Applicant Address: DEX Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DEX Munich
- Priority: DEX19631152 19960801
- Main IPC: H01R35/00
- IPC: H01R35/00 ; H01R43/01 ; H01R43/042 ; H01R43/04 ; H01R43/00
Abstract:
The device has a base frame having a lever arm that is pivotably mounted at one end and, at its other end, carries a pressure punch. The press punch is moved on a circular path toward individual wires as a result of a manual actuation of the lever arm, and presses the individual wires into IDC contacts as a result of pressure being exerted linearly by a handle provided on a pivoting element.
Public/Granted literature
- US5462806A Plastic lens Public/Granted day:1995-10-31
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