发明授权
- 专利标题: Grinding method and grinding apparatus
- 专利标题(中): 研磨方法和研磨装置
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申请号: US343833申请日: 1999-06-30
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公开(公告)号: US6152804A公开(公告)日: 2000-11-28
- 发明人: Shinichi Okuyama
- 申请人: Shinichi Okuyama
- 申请人地址: JPX Niigata
- 专利权人: System Seiko Co., Ltd.
- 当前专利权人: System Seiko Co., Ltd.
- 当前专利权人地址: JPX Niigata
- 优先权: JPX10-200710 19980715
- 主分类号: B24B7/17
- IPC分类号: B24B7/17 ; B24B49/08 ; B24B49/16 ; B24B49/00
摘要:
A work W is rotated on a lower grinding wheel 13 provided on a work support base 11. Both surfaces of the work W are simultaneously subjected to grinding process by an upper grinding wheel 24 provided on a grinding shaft 22 of a grinding head 21 and the lower grinding wheel 13. The work W is applied with a pressure force of a primary load through the grinding shaft 22 by a piston rod 36 of a primary pneumatic cylinder 35 which is operated by a first air pressure. The work W is also applied with a pressure force of a secondary load through a lever member 43 by a piston rod 46 of the secondary pneumatic cylinder 45 which is operated by a second air pressure higher than the first air pressure. By adjusting the second air pressure, the pressure force is controlled.
公开/授权文献
- US5523727A Dielectric waveguide including a tapered wave absorber 公开/授权日:1996-06-04
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