Invention Grant
- Patent Title: Transient voltage protection device with ceramic substrate
- Patent Title (中): 带陶瓷基板的瞬态电压保护装置
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Application No.: US371544Application Date: 1999-08-10
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Publication No.: US6160695APublication Date: 2000-12-12
- Inventor: Joan L. Winnett , Stephen J. Whitney , Edward G. Glass , Vernon Spaunhorst , Farid Ghaderi
- Applicant: Joan L. Winnett , Stephen J. Whitney , Edward G. Glass , Vernon Spaunhorst , Farid Ghaderi
- Applicant Address: TX Houston
- Assignee: Cooper Technologies
- Current Assignee: Cooper Technologies
- Current Assignee Address: TX Houston
- Main IPC: H01C7/12
- IPC: H01C7/12 ; H01T4/08 ; H01T21/00 ; H02H3/22
Abstract:
A method for fabricating transient voltage protection devices is described wherein a gap between a ground conductor and another conductor is formed using a diamond dicing saw. Substrate material selection and includes specific ceramic materials designed to optimize performance and manufacturability. An overlay layer can be provided to minimize burring of the conductors during formation of the gap.
Public/Granted literature
- US5879817A Reinforced concrete structure Public/Granted day:1999-03-09
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