- 专利标题: Ball grid array (BGA) encapsulation mold
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申请号: US352479申请日: 1999-07-13
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公开(公告)号: US6164946A公开(公告)日: 2000-12-26
- 发明人: Leonard E. Mess
- 申请人: Leonard E. Mess
- 申请人地址: ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: ID Boise
- 主分类号: B29C45/14
- IPC分类号: B29C45/14 ; B29C45/34 ; H01L21/56
摘要:
A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.
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