Invention Grant
- Patent Title: Printed-circuit assembly
- Patent Title (中): 印刷电路组件
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Application No.: US68763Application Date: 1998-08-11
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Publication No.: US06166457APublication Date: 2000-12-26
- Inventor: Daisuke Iguchi , Osamu Ueno
- Applicant: Daisuke Iguchi , Osamu Ueno
- Applicant Address: JPX Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX8-284688 19961007
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/16
Abstract:
A printed wiring board device used for electronic equipment, such as the information equipment, etc. A printed wiring board (10) has a power source layer (11) and a ground layer (12) and is mounted with active elements (3 and 4), such as digital ICs, etc. A first capacitor (1) which conductively couples the layers (11 and 12) with each other at a high frequency is provided in the peripheral section of one end side or the other end side of the section of the board (10) where the layers (11 and 12) are faced to each other. Second capacitors (2) which respectively supply transient currents to the active elements (3 and 4) are provided between the power supply pins (3V and 4V) of the elements (3 and 4) and the ground layer (12) near the elements (3 and 4). Therefore, the electromagnetic radiation caused by the power source layer (11) and the ground layer (12) of the printed wiring board (10) can be suppressed easily and remarkably.
Public/Granted literature
- USD406505S Combined football helmet bottle twist-off opener and key chain Public/Granted day:1999-03-09
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