Invention Grant
- Patent Title: Multi-electronic module mounting and retention mechanism
- Patent Title (中): 多电子模块安装和保持机构
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Application No.: US09164280Application Date: 1998-10-01
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Publication No.: US06172873B2Publication Date: 2001-01-09
- Inventor: David R. Davis , Vernon Erickson , John Schindler
- Applicant: David R. Davis , Vernon Erickson , John Schindler
- Main IPC: H05K720
- IPC: H05K720

Abstract:
A pair of risers are mounted on a mother or circuit board and trap one or two electronic circuit modules in an upstanding disposition and a bridging member extends between the risers. The bridging member forms a channel on its underside which engages a rail on a heat sink on one surface of the electronic module. The trappings of the rail by the bridging member positively restrains the module against movement away from the circuit board.
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