A method of physically altering the backside surface of a semiconductor wafer or other substrate, and resulting article, to improve adhesion between the backside surface of semiconductor dice singulated from the wafer and a die attach adhesive or encapsulation compound. The physically altered backside surface reduces or substantially eliminates delamination and cracking damage in a semiconductor die assembly due to semiconductor wafer tape contamination and subsequent moisture penetration. The physically altered backside surface further reduces both semiconductor wafer tape contamination and shear stress along the interface between the semiconductor die backside surface and the die attach adhesive or encapsulation compound.