发明授权
- 专利标题： Chip packaging
- 专利标题（中）： 芯片包装
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申请号： US09310727申请日： 1999-05-13
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公开(公告)号： US06184573B2公开(公告)日： 2001-02-06
- 发明人: Han-Ping Pu
- 申请人： Han-Ping Pu
- 主分类号： H01L23495
- IPC分类号： H01L23495
摘要：
The invention provides a chip package, particularly a dual-chip package, that is featured by directly connecting a lead frame to at least a chip included therein, and is specifically featured by directly connecting the inner leads of a lead frame to the bumps formed on at least two chips included therein.
信息查询
