发明授权
US06187088B1 Laser irradiation process 有权
激光照射工艺

  • 专利标题: Laser irradiation process
  • 专利标题(中): 激光照射工艺
  • 申请号: US09353358
    申请日: 1999-07-15
  • 公开(公告)号: US06187088B1
    公开(公告)日: 2001-02-13
  • 发明人: Hiroshi Okumura
  • 申请人: Hiroshi Okumura
  • 优先权: JP10-219200 19980803
  • 主分类号: C30B2802
  • IPC分类号: C30B2802
Laser irradiation process
摘要:
A pulse laser beam having a rectangular irradiation region is irradiated on the same point in a non-single crystal semiconductor film multiple times. The pulse laser beam has an energy profile in a longitudinal direction in the beam irradiation region as follows: (a) there are the first region having an energy density of Ea or higher and the second regions on both sides of the first region having an energy density of less than Ea, and (b) an energy density slope has an absolute value of 20 to 300 J/cm3 in a boundary region extending to 1 &mgr;m from the boundary line between the first and the second regions.
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