A wire for a wire saw apparatus for slicing a material includes an element wire, a binder coated on an outside circumferential surface of the element wire, and abrasive grains dispersed in the binder. The element wire is a high tensile strength metal wire, the binder is a material such as an organic or inorganic material other than a metal, and the abrasive grains are held on a surface of the element wire by the binder. The element wire is also made by either a natural quartz glass or a high purity synthesis quartz glass.