发明授权
- 专利标题： Semiconductor device having a ball grid array and a fabrication process thereof
- 专利标题（中）： 具有球栅阵列的半导体器件及其制造方法
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申请号： US09021954申请日： 1998-02-11
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公开(公告)号： US06207477B1公开(公告)日： 2001-03-27
- 发明人: Toshiyuki Motooka , Yoshiyuki Yoneda , Ryuji Nomoto , Toshimi Kawahara , Junichi Kasai
- 申请人： Toshiyuki Motooka , Yoshiyuki Yoneda , Ryuji Nomoto , Toshimi Kawahara , Junichi Kasai
- 优先权： JP9-212269 19970806
- 主分类号： H01L2144
- IPC分类号： H01L2144
摘要：
A method of fabricating a semiconductor device includes a step of attaching a circuit substrate on a semiconductor wafer in alignment with each other, providing an electrical interconnection between the circuit substrate and semiconductor devices formed in the wafer, providing solder bumps on the circuit substrate, and dicing the semiconductor wafer together with the circuit substrate thereon along a scribe line.