An object of the present invention is to provide a memory module capable of being mounted easily on various memory boards or mother boards, having a large memory capacity, and requiring a small mounting area. The memory module 10 includes four memory bare chips 1 scribed from a semiconductor wafer and mounted on a module board 2 by the COB technology. The module board 2 is formed with a row of pads 4 near the center portion in the longitudinal direction of the module board 2. Two memory bare chips 1 are disposed on the module board 2 at opposite sides of the pads 4. Each memory bare chip 1 is formed with pads 3 along the center line and the pads 3 are connected to the pads 4 on the module board 2 by the use of bonding wires 5. The bonding wires 5 and the memory bare chips 1 are covered with a plastic resin 6. Also, the module board 2 is formed with external connection terminals 8 on the outer side edges for connection to a memory board or a mother board by the LCC technology.