发明授权
US06214413B1 Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck
失效
在基板支撑卡盘上制造晶片间隔掩模的方法和装置
- 专利标题： Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck
- 专利标题（中）： 在基板支撑卡盘上制造晶片间隔掩模的方法和装置
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申请号： US09231323申请日： 1999-01-13
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公开(公告)号： US06214413B1公开(公告)日： 2001-04-10
- 发明人: Karl Brown
- 申请人： Karl Brown
- 主分类号： B05D132
- IPC分类号： B05D132
摘要：
A method and apparatus for fabricating a wafer spacing mask on a substrate support chuck. Such apparatus is a stencil containing a plurality of apertures and at least one high aspect ratio opening that is positioned atop the substrate support chuck while material is deposited onto the stencil and through the apertures and high aspect ratio openings onto the chuck. Upon completion of the deposition process, the stencil is removed from the workpiece support chuck leaving deposits of the material of various widths but the same heights to form the wafer spacing mask.