发明授权
- 专利标题： Electrostatic process control based upon both the roughness and the thickness of a substrate
- 专利标题（中）： 基于基板的粗糙度和厚度的静电过程控制
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申请号： US08520228申请日： 1995-08-28
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公开(公告)号： US06215552B1公开(公告)日： 2001-04-10
- 发明人: Thomas Acquaviva , Paul W. Morehouse, Jr.
- 申请人： Thomas Acquaviva , Paul W. Morehouse, Jr.
- 主分类号： G01B1130
- IPC分类号： G01B1130
摘要：
A method and apparatus for determining the properties of roughness and thickness of a substrate to be processed through a machine, and correspondingly adjusting those machine parameters that are affected and which can be optimized based on varying levels of these substrate properties.
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