发明授权
US06221221B1 Apparatus for providing RF return current path control in a semiconductor wafer processing system
有权
用于在半导体晶片处理系统中提供RF返回电流路径控制的装置
- 专利标题： Apparatus for providing RF return current path control in a semiconductor wafer processing system
- 专利标题（中）： 用于在半导体晶片处理系统中提供RF返回电流路径控制的装置
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申请号： US09192872申请日： 1998-11-16
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公开(公告)号： US06221221B1公开(公告)日： 2001-04-24
- 发明人: Ayad Al-Shaikh , Michael Rosenstein , Bradley O. Stimson , Jianming Fu , Praburam Gopalraja
- 申请人： Ayad Al-Shaikh , Michael Rosenstein , Bradley O. Stimson , Jianming Fu , Praburam Gopalraja
- 主分类号： C23C1434
- IPC分类号： C23C1434
摘要：
Apparatus providing a low impedance RF return current path between a shield member and a pedestal in a semiconductor wafer processing chamber. The return path reduces RF voltage drop between the shield member and the pedestal during processing. The return path comprises a conductive strap connected to the pedestal and a conductive bar attached to the strap. A toroidal spring makes multiple parallel electrical connections between the conductive bar and the shield member. A support assembly, attached to a collar on the chamber wall, supports the conductive bar.