发明授权
US06222214B1 Plug structure and process for forming stacked contacts and metal contacts on static random access memory thin film transistors
失效
一种用于在具有薄膜晶体管的静态随机存取存储器上形成堆叠的触点和金属触点的新型插头结构和工艺
- 专利标题: Plug structure and process for forming stacked contacts and metal contacts on static random access memory thin film transistors
- 专利标题(中): 一种用于在具有薄膜晶体管的静态随机存取存储器上形成堆叠的触点和金属触点的新型插头结构和工艺
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申请号: US08630111申请日: 1996-04-08
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公开(公告)号: US06222214B1公开(公告)日: 2001-04-24
- 发明人: Shou-Gwo Wuu , Mong-Song Liang , Chung-Hui Su , Chen-Jong Wang
- 申请人: Shou-Gwo Wuu , Mong-Song Liang , Chung-Hui Su , Chen-Jong Wang
- 主分类号: H01L27108
- IPC分类号: H01L27108
摘要:
A method for fabricating a novel plug structure for low resistance ohmic stacked contacts and at the same time forming metal contacts to devices on a SRAM cell was achieved. The method involved forming electrically conductive plugs in the stacked contact openings to form ohmic connections between a P+ doped polysilicon layer and a N+ doped polysilicon layer and thereby increasing the on current (Ion) of the SRAM cell. The electrical conductive plugs are also simultaneously formed in metal contact openings to devices areas elsewhere on the substrate. The process for the plug structure also reduces the mask set by one masking level over the prior art process.
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