发明授权
US06223893B1 Surface package type semiconductor package and method of producing semiconductor memory
失效
表面封装型半导体封装及半导体存储器的制造方法
- 专利标题： Surface package type semiconductor package and method of producing semiconductor memory
- 专利标题（中）： 表面封装型半导体封装及半导体存储器的制造方法
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申请号： US09387049申请日： 1999-08-31
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公开(公告)号： US06223893B1公开(公告)日： 2001-05-01
- 发明人: Wahei Kitamura , Gen Murakami , Kunihiko Nishi
- 申请人： Wahei Kitamura , Gen Murakami , Kunihiko Nishi
- 优先权： JP61-278610 19861125; JP62-206290 19870821
- 主分类号： B65D7302
- IPC分类号： B65D7302
摘要：
In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are sealed, by heat-sealing, in a bag moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging. The devices are packaged in a moisture-proofing bag made of a laminate film, and a desiccant is sealed, by heat-sealing the bag, in the moisture-proofing bag together with the, e.g., surface mount semiconductor device having a plastic package encapsulating the semiconductor device.
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