Invention Grant
US06226177B1 Friction hinge having high thermal conductivity 失效
具有高导热性的摩擦铰链

Friction hinge having high thermal conductivity
Abstract:
The invention is a friction hinge assembly for a laptop computer which has a high thermal conductivity. The assembly includes a base element, a base element fixed to the base of the computer and to which an axially aligned base heat pipe is coupled. The assembly also includes a lid element fixed to the lid of the computer. The lid element has a body portion and a rotatable sleeve attached to the lid and which receives a lid heat pipe. The base and lid elements are pre-assembled selectively fastenable to one another for ease of assembly of the lid to the base, and in order to control the frictional torque produced by the hinge during operation.
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