发明授权
- 专利标题: Solder alloy
- 专利标题(中): 焊锡合金
-
申请号: US09259136申请日: 1999-02-26
-
公开(公告)号: US06229248B1公开(公告)日: 2001-05-08
- 发明人: Shigemasa Kusabiraki , Manabu Sumita
- 申请人: Shigemasa Kusabiraki , Manabu Sumita
- 优先权: JP10-102992 19980414
- 主分类号: B23K3522
- IPC分类号: B23K3522
摘要:
The invention provides a solder alloy of Sn, Sb, Ag and Cu, wherein the Sb is about 1.0-3.0 wt %; the Ag is about 1.0 wt % or more and about 2.0 wt % or less; the Cu is about 1.0 wt % or less; and the remainder is Sn. The solder alloy has a comparatively low Young's modulus and sufficient tensile characteristics. Therefore, it resists peeling from the bonded electrode, etc., even though a heat stress is added. Also, a solder which has an excellent solderbility to metal phases such as Cu and Ni can be provided. Therefore, a solder alloy excellent in thermal shock resistance can be provided. The solder alloy may be used for soldering the inside of an electronic component.