An integrated circuit formed on a semiconductor substrate having multiple input/output signal paths such that the semiconductor substrate can be mounted to more than one package type. The integrated circuit formed on the semiconductor substrate has at least three pluralities of input output connector pads. The first plurality of input/output connector pads is placed on the semiconductor substrate and is attached to a first functional circuit of the integrated circuit. The second and third pluralities of input/output connector pads are placed on the semiconductor substrate and are attached to a second functional circuit of the integrated circuit. The third plurality of input/output connector pads is placed in an area separated from the first and second pluralities of input/output connector pads. Each input/output connector pads of the third plurality of input/output connector pads is connected to a corresponding input/output connector pad of the second plurality of input/output connector pads and thus to the second functional circuit. If the semiconductor substrate is mounted in a first package type, the second plurality of input/output connector pads is bonded to pins of the first package type to connect the second functional circuit to the external circuit, and the third plurality of input/output connector pads remain unbonded. If the semiconductor substrate is mounted in a second package type, the third plurality of input/output connector pads is bonded to pins of the second package type to connect the second functional circuit to the external circuit and the second plurality of input/output connector pads remain unbonded.