发明授权
US06231290B1 Processing method and processing unit for substrate 有权
基板加工方法及加工单元

  • 专利标题: Processing method and processing unit for substrate
  • 专利标题(中): 基板加工方法及加工单元
  • 申请号: US09271341
    申请日: 1999-03-18
  • 公开(公告)号: US06231290B1
    公开(公告)日: 2001-05-15
  • 发明人: Hisashi KikuchiKatsumi Ishii
  • 申请人: Hisashi KikuchiKatsumi Ishii
  • 优先权: JP10-094006 19980323
  • 主分类号: B65G4907
  • IPC分类号: B65G4907
Processing method and processing unit for substrate
摘要:
A processing unit for a substrate comprises a partition 6 provided between an atmospheric area S1 and an inert gas area S2. The partition 6 has an opening 22 to communicate the atmospheric area S1 and the inert gas area S2. A door 23 is provided at the opening 22 to open and close it. Carrier holding device 11 is provided for holding a carrier 2 of the substrate in such a manner that the carrier 2 comes in contact with the opening 22 on the side of the atmospheric area. Inert gas replacing device 56 is provided for replacing a gas in the carrier 2 with an inert gas by introducing the inert gas into the carrier 2 when the door 23 closes the opening 22 and the carrier 2 comes in contact with the opening 22 on the side of the atmospheric area by the carrier holding device 11. This processing unit can perform the process of the substrate without increasing the concentration of the oxygen in the inert gas area S2 by preventing leakage of the air from the atmospheric area S1 into the inert gas area S2.
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