Invention Grant
- Patent Title: Encapsulation of printed circuit boards
- Patent Title (中): 封装印刷电路板
-
Application No.: US09324830Application Date: 1999-06-03
-
Publication No.: US06233155B1Publication Date: 2001-05-15
- Inventor: Erik Möster , Paul Larsson , Mats Olsson , Olof Simonsson , Mats Larsson , Rafael Portela
- Applicant: Erik Möster , Paul Larsson , Mats Olsson , Olof Simonsson , Mats Larsson , Rafael Portela
- Main IPC: H05K500
- IPC: H05K500

Abstract:
A housing for electronic components is injection molded as a unitary, single-piece, monolithic piece, and includes a front cover, a back cover, and a living hinge. Electronic components, including a PCB, are contained within the housing. A cosmetic cover is secured to the housing over the living hinge, which protrudes from the housing, to make the housing more appealing.
Information query