Invention Grant
US06233155B1 Encapsulation of printed circuit boards 有权
封装印刷电路板

Encapsulation of printed circuit boards
Abstract:
A housing for electronic components is injection molded as a unitary, single-piece, monolithic piece, and includes a front cover, a back cover, and a living hinge. Electronic components, including a PCB, are contained within the housing. A cosmetic cover is secured to the housing over the living hinge, which protrudes from the housing, to make the housing more appealing.
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