- 专利标题: Chemical-mechanical polish machines and fabrication process using the same
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申请号: US09425454申请日: 1999-10-22
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公开(公告)号: US06234876B1公开(公告)日: 2001-05-22
- 发明人: Juen-Kuen Lin , Chien-Hsin Lai , Peng-Yih Peng , Kun-Lin Wu , Daniel Chiu , Chih-Chiang Yang , Juan-Yuan Wu , Hao-Kuang Chiu
- 申请人: Juen-Kuen Lin , Chien-Hsin Lai , Peng-Yih Peng , Kun-Lin Wu , Daniel Chiu , Chih-Chiang Yang , Juan-Yuan Wu , Hao-Kuang Chiu
- 优先权: TW86214921 19970901; TW86118024 19971201
- 主分类号: B24B100
- IPC分类号: B24B100
摘要:
A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.