发明授权
- 专利标题： Metallization outside protective overcoat for improved capacitors and inductors
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申请号： US09183821申请日： 1998-10-30
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公开(公告)号： US06236101B1公开(公告)日： 2001-05-22
- 发明人: John P. Erdeljac , Louis Nicholas Hutter , M. Ali Khatibzadeh , John Kenneth Arch
- 申请人： John P. Erdeljac , Louis Nicholas Hutter , M. Ali Khatibzadeh , John Kenneth Arch
- 主分类号： H01L2900
- IPC分类号： H01L2900
摘要：
A thick layer of copper is formed on the outside the protective overcoat (PO) which protects an integrated circuit, and forms both an inductor and the upper electrode of a capacitor. Placing this layer outside the PO greatly reduces parasitic capacitances with the substrate in the devices.
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