发明授权
- 专利标题: Chip type solid electrolytic capacitor and its manufacturing method
- 专利标题(中): 片式固体电解电容器及其制造方法
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申请号: US09334771申请日: 1999-06-16
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公开(公告)号: US06236561B1公开(公告)日: 2001-05-22
- 发明人: Masakuni Ogino , Masahiro Yabushita , Koji Ueoka , Takashi Iwakiri , Tsuyoshi Yoshino
- 申请人: Masakuni Ogino , Masahiro Yabushita , Koji Ueoka , Takashi Iwakiri , Tsuyoshi Yoshino
- 优先权: JP10-171058 19980618; JP11-117645 19990426
- 主分类号: H01G900
- IPC分类号: H01G900
摘要:
A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.
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