发明授权
- 专利标题： Polishing compound and a polishing method for silicon wafer
- 专利标题（中）： 抛光复合物和硅晶片抛光方法
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申请号： US09389605申请日： 1999-09-03
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公开(公告)号： US06238272B1公开(公告)日： 2001-05-29
- 发明人: Hiroaki Tanaka , Akitoshi Yoshida , Yoshihisa Ogawa
- 申请人： Hiroaki Tanaka , Akitoshi Yoshida , Yoshihisa Ogawa
- 优先权： JP10-251507 19980904
- 主分类号： B24B100
- IPC分类号： B24B100
摘要：
The present invention is a polishing compound comprising a colloidal solution of silicon oxide to which an alkaline component and an acid component are added in order to have a buffering action, wherein said alkali component is a quaternary ammonium whose carbon number per one molecular is smaller than 12, and said acid component is at least one selected from the group composed by carbonic acid, boric acid and silicic acid.
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