The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing an organic acid such as formic acid, acetic acid, propanoic acid, butyric acid and the mixtures thereof, in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the organic acid is supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the organic acid is contacted to the heat sensitive device either directly or indirectly.