A digital cross-connect module with a housing formed of two portions which slidably engage one another. One of the portions includes tabs which engage slots formed in the other portion. The two portions are formed of plastic, so the module housing is lighter and easier to produce than conventional housings. The housing contains a printed circuit board (PCB). The PCB has a first plurality of jacks adjacent the front of the housing and a second plurality of jacks adjacent the rear of the housing for cross-connecting digital signals.