发明授权
- 专利标题： Package, method of manufacturing the package and packet of the package
- 专利标题（中）： 包装，包装的包装和包装的制造方法
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申请号： US08809718申请日： 1997-03-28
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公开(公告)号： US06244442B1公开(公告)日： 2001-06-12
- 发明人: Isao Inoue , Kiyoshi Oguchi , Masaho Hayashi , Atushi Saiki
- 申请人： Isao Inoue , Kiyoshi Oguchi , Masaho Hayashi , Atushi Saiki
- 优先权： JP7-235755 19950913; JP7-337372 19951225; JP7-337385 19951225; JP8-147659 19960610; JP8-168681 19960610
- 主分类号： B65D8304
- IPC分类号： B65D8304
摘要：
A package (10) has blisters (11) each having an embossed hollow (12) with an open end, for containing a tablet (15), and a flange (13) extending around the open end of the embossed hollow (12). The flanges (13) of the blisters (11) are bonded to a covering sheet 20. The blisters (11) are formed separately, and the flange (13) of each blister (11) has a circular shape.