Invention Grant
- Patent Title: Method of forming oxynitride gate dielectric
- Patent Title (中): 形成氮氧化物栅极电介质的方法
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Application No.: US09226369Application Date: 1999-01-06
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Publication No.: US06245616B1Publication Date: 2001-06-12
- Inventor: Douglas Andrew Buchanan , Matthew Warren Copel , Patrick Ronald Varekamp
- Applicant: Douglas Andrew Buchanan , Matthew Warren Copel , Patrick Ronald Varekamp
- Main IPC: H01L21336
- IPC: H01L21336

Abstract:
A method for forming an oxynitride gate dielectric in a semiconductor device and gate dielectric structure formed by the method are disclosed. In the method, an oxynitride layer is first formed on a silicon surface and then re-oxidized with a gas mixture containing oxygen and at least one halogenated species such that an oxynitride layer with a controlled nitrogen profile and a layer of substantially silicon dioxide formed underneath the oxynitride film is obtained. The oxynitride film layer can be formed by either contacting a surface of silicon with at least one gas that contains nitrogen and/or oxygen at a temperature of not less than 500° C. or by a chemical vapor deposition technique. The re-oxidation process may be carried out by a thermal process in an oxidizing halogenated atmosphere containing oxygen and a halogenated species such as HCl, CH2Cl2, C2H3Cl3, C2H2Cl2, CH3Cl and CHCl3.
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