发明授权
- 专利标题： Ceramics substrate with electronic circuit and its manufacturing method
- 专利标题（中）： 陶瓷基板与电子电路及其制造方法
-
申请号： US09501683申请日： 2000-02-10
-
公开(公告)号： US06248960B1公开(公告)日： 2001-06-19
- 发明人: Norihiro Ami , Masahide Okamoto , Shosaku Ishihara , Minoru Tanaka , Mutsumi Horikoshi , Akihiro Yasuda
- 申请人： Norihiro Ami , Masahide Okamoto , Shosaku Ishihara , Minoru Tanaka , Mutsumi Horikoshi , Akihiro Yasuda
- 优先权： JP11-041042 19990219
- 主分类号： H01R1204
- IPC分类号： H01R1204
摘要：
In a ceramic wiring board which comprises a copper via, breaks and defects of via interconnections resulting from enlargement of copper particles in the interior of the via during sintering, are prevented. For this purpose, alumina of mean particle diameter from 1 &mgr;m to 4 &mgr;m is disposed in the interior of the via interconnection after sintering at an average interval of 7.4 &mgr;m or less.
信息查询
