发明授权
- 专利标题： Structure for mounting two printed circuit boards to one case
- 专利标题（中）： 将两个印刷电路板安装到一个外壳的结构
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申请号： US09441597申请日： 1999-11-17
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公开(公告)号： US06249442B1公开(公告)日： 2001-06-19
- 发明人: Hideki Watanabe
- 申请人： Hideki Watanabe
- 优先权： JP10-333796 19981125
- 主分类号： H05K500
- IPC分类号： H05K500
摘要：
A printed circuit board mounting structure is disclosed wherein first and second printed circuit boards are mounted by mounting projections formed on a case. Since the mounting projections can be used in common for both first and second printed circuit boards, the printed circuit board mounting structure of the invention is simple in the mounting work, high in productivity and low in cost as compared with a conventional like structure wherein first and second printed circuit boards are mounted to different mounting projections.
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