Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate

Invention Grant

US06252175B1 Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate 有权

Title translation: 电子组件包括基板和固定到基板的端子的多个可弹性互连元件

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Patent Title: Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate
Patent Title (中): 电子组件包括基板和固定到基板的端子的多个可弹性互连元件
Application No.: US09397779

Application Date: 1999-09-16
Publication No.: US06252175B1

Publication Date: 2001-06-26
Inventor: Igor Y. Khandros
Applicant: Igor Y. Khandros
Main IPC: H05K702
IPC: H05K702

Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate

Abstract:

An electronic assembly comprising an electronic substrate and a plurality of conductive interconnection elements. The substrate has a first side having a plurality of terminals. Each interconnection element has a base secured to a respective one of the terminals, a contact region distant from the electronic substrate, and an elongate freestanding section which can bend when pressure is applied to the contact region.

Abstract(Chinese):

一种电子组件，包括电子基板和多个导电互连元件。基板具有具有多个端子的第一侧。每个互连元件具有固定到相应的端子之一的基座，远离电子基板的接触区域和当压力施加到接触区域时可以弯曲的细长的独立部分。

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