A method and carrier for testing semiconductor dice such as bare dice or chip scale packages are provided. The carrier includes a base for retaining a single die, an interconnect for establishing temporary electrical communication with the die, and a force applying mechanism for biasing the die and interconnect together. In an illustrative embodiment the base includes conductors arranged in a universal pattern adapted to electrically connect to different sized interconnects. Interconnects are thus interchangeable on a base for testing different types of dice using the same base. The conductors on the base can be formed on a planar active surface of the base or on a stepped active surface having different sized cavities for mounting different sized interconnects. In an alternate embodiment the carrier includes an interposer. In a first interposer embodiment, the interposer connects directly to external test circuitry and can be changed to accommodate different sized interconnects. In a second interposer embodiment, the interposer connects to conductors on the base and adapts the base for use with different sized interconnects.