发明授权
- 专利标题： Modular high frequency integrated circuit structure
- 专利标题（中）： 模块化高频集成电路结构
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申请号： US09330614申请日： 1999-06-11
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公开(公告)号： US06259148B1公开(公告)日： 2001-07-10
- 发明人: Thomas Adam Bartush , David Louis Harame , John Chester Malinowski , Dawn Tudryn Piciacchio , Christopher Lee Tessler , Richard Paul Volant
- 申请人： Thomas Adam Bartush , David Louis Harame , John Chester Malinowski , Dawn Tudryn Piciacchio , Christopher Lee Tessler , Richard Paul Volant
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
Disclosed is a manufacturable silicon-based modular integrated circuit structure having performance characteristics comparable to high frequency GaAs-based integrated circuit structures, comprising materials and made in process steps which are compatible with existing low cost silicon-based integrated circuit processing.
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