发明授权
US06267902B1 Process for removing a coating from a hole in a metal substrate 失效
从金属基板的孔中除去涂层的工序

  • 专利标题: Process for removing a coating from a hole in a metal substrate
  • 专利标题(中): 从金属基板的孔中除去涂层的工序
  • 申请号: US09211484
    申请日: 1998-12-15
  • 公开(公告)号: US06267902B1
    公开(公告)日: 2001-07-31
  • 发明人: Thomas Joseph CartierD. Sangeeta
  • 申请人: Thomas Joseph CartierD. Sangeeta
  • 主分类号: C23F100
  • IPC分类号: C23F100
Process for removing a coating from a hole in a metal substrate
摘要:
A method of removing a coating from the surface of a hole in a metal-based substrate is described. The coating is scored on or near the surface of the hole. The substrate is then treated with a coating-removal solution under conditions suitable for removing the coating without damaging the substrate or any intervening bond layer. The coating is often a zirconia-based thermal barrier coating. In such a case, a caustic solution is used to remove the coating within an autoclave. The substrate can be a component of a turbine engine.
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