发明授权
US06268250B1 Efficient fabrication process for dual well type structures 有权
双井型结构的高效制造工艺

  • 专利标题: Efficient fabrication process for dual well type structures
  • 专利标题(中): 双井型结构的高效制造工艺
  • 申请号: US09311632
    申请日: 1999-05-14
  • 公开(公告)号: US06268250B1
    公开(公告)日: 2001-07-31
  • 发明人: Mark A. Helm
  • 申请人: Mark A. Helm
  • 主分类号: H01L218234
  • IPC分类号: H01L218234
Efficient fabrication process for dual well type structures
摘要:
An efficient method for fabricating dual well type structures uses the same number of masks used in single well type structure fabrication. In a preferred embodiment, the current invention allows low voltage and high voltage n-channel transistors and low voltage and high voltage p-channel transistors to be formed in a single substrate. One mask is used for forming a diffusion well, a second mask for both forming a retrograde well and doping the well to achieve an intermediate threshold voltage in that well, and a third mask for both differentiating the gate oxides for the low voltage devices and doping the threshold voltages to achieve the final threshold voltages.
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