发明授权
US06271129B1 Method for forming a gap filling refractory metal layer having reduced stress 失效
用于形成具有减小的应力的填充难熔金属层的间隙填充方法

  • 专利标题: Method for forming a gap filling refractory metal layer having reduced stress
  • 专利标题(中): 用于形成具有减小的应力的填充难熔金属层的间隙填充方法
  • 申请号: US08984438
    申请日: 1997-12-03
  • 公开(公告)号: US06271129B1
    公开(公告)日: 2001-08-07
  • 发明人: Steve GhanayemMaitreyee Mahajani
  • 申请人: Steve GhanayemMaitreyee Mahajani
  • 主分类号: H01L2144
  • IPC分类号: H01L2144
Method for forming a gap filling refractory metal layer having reduced stress
摘要:
A method for forming a refractory metal layer that features two-stage nucleation prior to bulk deposition of the same. The method includes placing a substrate in a deposition zone, flowing, into the deposition zone during a first deposition stage, a silicon source, such as a silane gas, and a tungsten source, such as tungsten-hexafluoride gas, so as to obtain a predetermined ratio of the two gases therein. During a second deposition stage, subsequent to the first deposition stage, the ratio of the two gases is varied. Specifically, in the first deposition stage there is a greater quantity of silane gas than tungsten-hexafluoride gas. In the second deposition stage there may be a greater quantity of tungsten-hexafluoride than silane.
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