Invention Grant
- Patent Title: Grounding cable
- Patent Title (中): 接地电缆
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Application No.: US09413245Application Date: 1999-10-07
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Publication No.: US06271466B1Publication Date: 2001-08-07
- Inventor: Masaki Tsuneoka , Yoshinao Okawa , Yoshihiro Murano , Kenichi Okada
- Applicant: Masaki Tsuneoka , Yoshinao Okawa , Yoshihiro Murano , Kenichi Okada
- Priority: JP10-301754 19981009
- Main IPC: H01B1106
- IPC: H01B1106

Abstract:
A method of preventing a high-frequency noise generated in an electronic device, remaining in a grounding cable as a standing wave and transmitted to electric devices, is disclosed, which method including disposing, directly or via an insulating layer, a non-metallic conductive material having a slight electric resistance, on a conductor of the above-mentioned grounding cable, making the electric resistance of the non-metallic conductive material consume the high-frequency noise flowing on the conductor surface of the grounding cable by virtue of a skin effect, whereby resonance of the high-frequency noise is reduced. Resonance of the high-frequency noise generated from various electronic devices in an office building and the like can be easily reduced. Consequently, various disadvantages due to high-frequency noise can be avoided. In addition, the slight electric resistance R of the non-metallic conductive material and inductance L of the metal conductor are set to satisfy the formula: 2&pgr;fL/R≦1, so that the resonance of a high-frequency noise can be reduced.
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