发明授权
- 专利标题： Wire bonding method and apparatus and semiconductor device
- 专利标题（中）： 引线接合方法及装置及半导体器件
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申请号： US09305448申请日： 1999-05-06
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公开(公告)号： US06271601B1公开(公告)日： 2001-08-07
- 发明人: Noriaki Yamamoto , Yukinori Taneda , Hirohisa Yamamura , Akio Yasukawa , Osamu Suzuki , Tatsuya Shigemura
- 申请人： Noriaki Yamamoto , Yukinori Taneda , Hirohisa Yamamura , Akio Yasukawa , Osamu Suzuki , Tatsuya Shigemura
- 优先权： JP10-128586 19980512
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 &mgr;m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.
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