A probe card treatment method, which is applicable on a probe card comprising multiple probe needles, is described. A thermal treatment is conducted on the probe card by placing the probe card in a closed heating device, wherein the temperature of the thermal treatment is enough to restore the elasticity and the planarity of the probe needles without softening the probe card. The probe card and the probe needles thereon are then rapidly cooled by cool air such that the elasticity of the probe needles is retained and the lifetime of the probe needles is extended.