发明授权
- 专利标题： Method for the manufacture of printed circuit boards with plated resistors
- 专利标题（中）： 制造带电镀电阻的印刷电路板的方法
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申请号： US09603978申请日： 2000-06-27
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公开(公告)号： US06281090B1公开(公告)日： 2001-08-28
- 发明人: Peter Kukanskis , Gary B. Larson , Jon Bengston , William Schweikher
- 申请人： Peter Kukanskis , Gary B. Larson , Jon Bengston , William Schweikher
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A process is revealed whereby resistors can be manufactured integral with the printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.
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