发明授权
US06281590B1 Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
失效
用于在多芯片模块中的各个集成电路芯片之间提供互连的电路和方法
- 专利标题： Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
- 专利标题（中）： 用于在多芯片模块中的各个集成电路芯片之间提供互连的电路和方法
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申请号： US08838536申请日： 1997-04-09
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公开(公告)号： US06281590B1公开(公告)日： 2001-08-28
- 发明人: Thaddeus John Gabara , King Lien Tai
- 申请人： Thaddeus John Gabara , King Lien Tai
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A multi-chip module (“MCM”) and methods of operation and manufacture thereof The MCM includes: (1) a substrate for supporting a plurality of separate integrated circuit (IC) chips thereon, (2) first and second separate IC chips mounted on the substrate, the first separate IC chip including first and second circuit portions coupled together by at least one signal conductor, and (3) interconnecting means that directly couples at least one signal conductor of the first separate IC chip to the second separate IC chip, the interconnecting means bypassing the second circuit portion of the first separate IC chip.
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