The molding composition comprises components A, B and, if desired, components C to E, the total weight of which is 100% by weight: a: as component A, from 5 to 95% by weight of a random copolyamide made from a1: from 95.1 to 99.9% by weight of component A1 made from equimolar amounts of at least one linear aliphatic diamine and at least one linear aliphatic dicarboxylic acid a2: from 0.1 to 4.9% by weight of component A2 made from equimolar amounts of at least one linear aliphatic diamine and isophthalic acid b: from 5 to 95% by weight of a copolymer component B, different from component A, selected from: b1: component B1 made from at least one, if desired modified, polyarylene ether, or b2: component B2 made from, as component B21, from 60 to 99% by weight of at least one polyolefin homo- or copolymer and, as component B22, from 1 to 40% by weight of at least one modified polyolefm homo- or copolymer, or b3: component B3 made from, as component B31, from 70 to 100% by weight of at least one SAN, ABS or ASA polymer and, as component B32, from 0 to 30% by weight of at least one modified SAN, ABS or ASA polymer c: as component C, from 0 to 20% by weight of at least one impact modifier d: as component D, from 0 to 50% by weight of at least one filler e: as component E, from 0 to 20% by weight of customary additives.