发明授权
US06287171B1 System and method for detecting CMP endpoint via direct chemical monitoring of reactions
失效
通过反应的直接化学监测来检测CMP端点的系统和方法
- 专利标题： System and method for detecting CMP endpoint via direct chemical monitoring of reactions
- 专利标题（中）： 通过反应的直接化学监测来检测CMP端点的系统和方法
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申请号： US09504565申请日： 2000-02-15
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公开(公告)号： US06287171B1公开(公告)日： 2001-09-11
- 发明人: Mark Meloni
- 申请人： Mark Meloni
- 主分类号： B24B100
- IPC分类号： B24B100
摘要：
A system and method for detecting process endpoint in CMP is presented which monitors the progression of chemical activities that take place from the chemical reaction that occurs at the wafer surface during polishing. In order to monitor the progression of chemical activities taking place from the chemical reaction, a surface plasmon resonance sensor acts as a conducting surface which supports surface plasmon resonance.
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