发明授权
- 专利标题： Soldering assembly
- 专利标题（中）： 焊接组件
-
申请号： US09313934申请日： 1999-05-18
-
公开(公告)号： US06288365B1公开(公告)日： 2001-09-11
- 发明人: Matthew J. McAmmond , Joseph H. Mickle
- 申请人： Matthew J. McAmmond , Joseph H. Mickle
- 主分类号： H05B100
- IPC分类号： H05B100
摘要：
A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.
信息查询
