The process of bonding a first workpiece to a second workpiece is disclosed comprising the steps of fabricating a sintered bonding pad formed from a matrix of randomly oriented metallic fibers. The bonding pad is interposed between the first and the second workpiece and the first and second workpieces are biased into engagement with the bonding pad. Heat is applied to the first workpiece to the second workpiece for transforming substantially all of the metallic fibers into a liquid for bonding the first workpiece to the second workpiece.