发明授权
- 专利标题: Sensor package manufacture optimization
- 专利标题(中): 传感器封装制造优化
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申请号: US09274043申请日: 1999-03-22
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公开(公告)号: US06291818B1公开(公告)日: 2001-09-18
- 发明人: Robert W. Allport , Graeme Ferrari , Paul Mitchell , David Morgan
- 申请人: Robert W. Allport , Graeme Ferrari , Paul Mitchell , David Morgan
- 主分类号: H01J502
- IPC分类号: H01J502
摘要:
In order to locate a package (110) which houses active elements including an opto-electric type transducer (100), in a position which assures that the opto-electric sensor and other active elements will be located in proper operative positions when the package is installed in predetermined piece of apparatus, the package casing (102) is provided with location features (112) at least some of which are deformable. During optimization, the package is moved with respect to a target until such time as the sensor is detected as producing an optimal output. Selected location features are then deformed to form location faces (112a) which have a predetermined spatial relationship with the active elements and which ensure that the active elements will be supported in an optimally operative position when the package is operatively disposed in a device such as an optical scanner or the like.
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